Process Development Engineer (Wafer Level Packaging)
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Singapore
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Summary The WLP Development Engineer will support R&D and process integration activities for 2.5D wafer-level packaging (WLP) technologies, focusing on Die Preparation , Chip Attach , and Molding processes. The role ensures process reliability, manufacturability, and seamless integration for next-generation semiconductor packages used in AI, HPC, and memory applications . Key Responsibilities Deve...
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